Position: DIP Assistant Manager
Location: Bangpoo, Samutprakan
Responsibilities:
Oversee and manage the entire Through-Hole Technology (THT) or DIP (Dual In-line Package) assembly process, including component preparation, manual insertion (plug-in), hand soldering, and/or wave soldering operations.
Lead capacity planning and resource allocation (manpower, equipment) to ensure production targets and deadlines are met efficiently within the DIP area.
Responsible for the setup, troubleshooting, and maintenance of specialized DIP machinery such as Wave Soldering machines, lead cutting machines, and soldering stations.
Manage and develop the DIP production team, providing training and guidance to operators on standard soldering techniques (e.g., IPC-A-610 standards) and strict ESD prevention protocols.
Analyze and resolve quality issues specific to the DIP process (e.g., cold joints, solder bridges, insufficient solder) to continuously improve the overall production yield rate.
Act as the primary liaison between the DIP production team and other departments, including Manufacturing Engineering, Quality Control (QC/QA), and Maintenance, ensuring smooth operational flow and adherence to specifications.
Initiate and drive process improvement projects utilizing methodologies like Lean or Six Sigma to reduce waste, lower production costs, and enhance the overall efficiency of the DIP production line.
Qualifications:
7 years up MFG experience + PCBA
- Knowledge of production efficiency improvement
- Knowledge of production and stock balance control
Ability of cost control
SMT background is plus